Journal of Radio Electronics. eISSN 1684-1719. 2026. №4
Full text in Russian (pdf)
DOI: https://doi.org/10.30898/1684-1719.2026.4.5
INVESTIGATION OF THE HETEROGENEITY OF THERMAL PARAMETERS
OF A HIGH-TEMPERATURE INTEGRATED MICROCIRCUIT
I.V. Frolov1, V.A. Sergeev1, D.V. Kleimenkin2, P.S. Budyakov3
1Ulyanovsk Branch of the Kotelnikov Institute of Radioengineering and Electronics of RAS,
432011, Russia, Ulyanovsk, Goncharova St., 48/22Don State Technical University,
344000, Russia, Rostov-on-Don, Gagarin Square, 13 Innocenter VAO,
107564, Russia, Moscow, Krasnobogatyrskaya str., 2, page 2
The paper was received March 11, 2026.
Abstract. The thermal characteristics of a commercially available high-temperature AD8229HDZ microcircuit, which is a high-precision instrument amplifier operating in the temperature range from −40°C to +210 °C. To measure the thermal characteristics, built-in protective diodes were used as heat source elements, connected in parallel to each pin of the microcircuit relative to the power supply pins of positive and negative polarity. Based on the results of measurements of the thermal impedance module, the values of four components of thermal resistance corresponding to the individual layers of the microcircuit design were identified and determined: the crystal, the solder layer, the ceramic landing pad and the housing. It is determined that the values of the thermal resistance of the crystal-solder layer, measured by symmetrically arranged protective diodes, vary within 3-4 %. Based on the results of measuring the temperature dependences of the thermal resistance of the crystal-solder layer junction in the temperature range from 25 °C to 150 °C, a difference in the steepness of the increase in thermal resistance with increasing temperature was revealed for symmetrically arranged protective diodes at the inverting and non-inverting inputs of the amplifier. It is shown that at a microcircuit body temperature of 200 °C, the difference in thermal resistances reaches 2 K/W, which may cause an imbalance of currents in the differential cascade and the appearance of additional signal distortions.
Keywords: high-temperature integrated microcircuit, thermal characteristics, measurement, evaluation of heterogeneity.
Financing: The research has been carried out at the expense of the Grant of the Russian Science Foundation No. 23-79-10069, https://rscf.ru/en/project/23-79-10069/
Correspondingauthor: Frolov Ilya Vladimirovich, ilya-frolov88@mail.ru
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For citation:
Frolov I.V., Sergeev V.A., Kleimenkin D.V., Budyakov P.S. Investigation of the heterogeneity of thermal parameters of a high-temperature integrated microcircuit. // Journal of Radio Electronics. – 2026. – №. 4. – 2026. – № 4. https://doi.org/10.30898/1684-1719.2026.4.5 (In Russian)