Zhurnal Radioelektroniki - Journal of Radio Electronics. eISSN 1684-1719. 2022. №8
Contents

Full text in Russian (pdf)

Russian page

 

DOI: https://doi.org/10.30898/1684-1719.2022.8.11

COMPARATIVE ANALYSIS OF METHODS OF MEASURING THERMAL PARAMETERS

OF INTEGRATED MICROWAVE POWER AMPLIFIERS

ON BIPOLAR TRANSISTORS

 

V.I. Smirnov 1,2, V.А. Sergeev 1, A.A. Gavrikov 1, R.G. Tarasov 3

 

1 Ulyanovsk Branch of Kotelnikov IRE RAS

432071, Russia, Ulyanovsk, Goncharov st. 48/2

2 Ulyanovsk State Technical University

432027, Russia, Ulyanovsk, Severnyy Venets 32

3 Joint Stock Company Scientific and Production Enterprise Zavod Iskra

432030, Russia, Ulyanovsk, Narimanova Ave. 75

 

The paper was received July 11, 2022

 

Abstract. A brief analysis of methods and features of measuring thermal parameters of integrated microwave power amplifiers on bipolar transistors (BT) is presented. The hardware and software complex implementing the method of measuring the thermal parameters of the amplifier according to OST 11 0944-96 and the original modulation method is described. In both methods, the temperature of the active region of BT crystals is determined by a change in a certain temperature-sensitive parameter (TSP) of BT when they are heated by pulsed power. The results of comparative measurements of the thermal resistance of the junction-housing of the L-band integrated microwave amplifier on silicon BT are presented. The optimal duration of the heating pulses in the standard method was determined based on the analysis of the previously measured transient thermal characteristics of the amplifier. To exclude the influence of transients when switching the amplifier from the heating mode to the measurement mode, the temperature of the BT crystal at the end of the heating power pulse was determined by interpolating the results of several TSP measurements under the assumption that the crystal cooling curve has a root character. It is shown that the results of measuring the thermal resistance of the junction-housing of an integral microwave amplifier by both methods are in good agreement with each other.

Key words: integrated microwave power amplifiers, thermal parameters, measurement, modulation method.

Financing: The work was supported by the Russian Science Foundation, project number 22-29-01134.

Corresponding author: Sergeev Vyacheslav Andreevich, sva@ulstu.ru

 

References

1. Sechi F., Bujatti M. Moshchnyye tverdotelʹnyye SVCH-usiliteli [Power solid-state microwave amplifiers]. Moscow, Tekhnosfera. 2015. 416 p. (In Russian)

2. Retnyuk V. The choice of microwave transistor technology for use in power amplifiers. SVCH-elektronika [Microwave electronics]. 2018. №2. P.4-6. (In Russian)

3. Sergeev V.A., Khodakov A.M., Tarasov R.G. Calculation and measurement of thermal parameters of monolithic integrated circuits of microwave amplifiers as part of X-band output power amplifiers. Zhurnal radioelektroniki [Journal of Radio Electronics]. 2019. №8. https://doi.org/10.30898/1684-1719.2019.8.12 (In Russian)

4. Mahalingam M., Mares E. Infrared temperature characterization of high power RF devices. 2001 IEEE MTT-S International Microwave Sympsoium Digest. 2001. V.3. P.2199-2202. https://doi.org/10.1109/MWSYM.2001.967352

5. He J., Mehrotra V., Shaw M.C. Ultra-high resolution temperature measurement and thermal management of RF power devices using heat pipes. 11th International Symposium on Power Semiconductor Devices and ICs. ISPSD'99 Proceedings. 1999. P.145-148. https://doi.org/10.1109/ISPSD.1999.764083

6. Cinà L., Di Carlo A., Reale A. Thermal Model of High-Power Amplifiers Based on Time-Dependent Temperature Profiles Measured by Photoconductance. IEEE Transactions on Electron Device. 2018. V.65. №5. P.1739-1744. https://doi.org/10.1109/TED.2018.2814921

7. OST 11 0944-96. Mikroskhemy integralʹnyye i pribory poluprovodnikovyye. Metody rascheta, izmereniya i kontrolya teplovogo soprotivleniya [Integrated circuits and semiconductor devices. Methods of calculation, measurement and control of thermal resistance]. Moscow, SUE NPP Pulsar. 1997. 110 p. (In Russian)

8. Blackburn D.L., Oettinger F.F. Transient Thermal Response Measurements of Power Transistors. IEEE Transactions on Industrial Electronics. Control Instruments. 1976. №2. P.134-142. https://doi.org/10.1109/PESC.1974.7074340

9. Smirnov V.I., Sergeev V.A., Gavrikov A.A., Shorin A.M. Modulation method for measuring thermal impedance components of semiconductor devices. Microelectronics Reliability. 2018. V.80. P.205-212. https://doi.org/10.1016/j.microrel.2017.11.024

10. Smirnov V.I., Gavrikov A.A., Shorin A.M. Method of measuring components of thermal resistance of semiconductor devices and its practical implementation. Avtomatizatsiya protsessov upravleniya [Automation of control processes]. 2017. №2 (48). P.98-105. (In Russian)

11. Smirnov V.I., Sergeev V.A., Gavrikov A.A., Shorin A.M. Measurements of thermal impedance of high-power transistors. Radiotehnika [Radio Engineering]. 2017. 6. P.83-90. (In Russian)

12. Smirnov V.I., Sergeev V.A., Gavrikov A.A., Kulikov A.A., Shorin A.M. Comparative analysis of standard and modulation methods for measuring thermal resistance of high-power bipolar transistors. Zhurnal radioelektroniki [Journal of Radio Electronics]. 2019. №1. https://doi.org/10.30898/1684-1719.2019.1.3 (In Russian)

For citation:

Smirnov V.I., Sergeev V.A., Gavrikov A.A., Tarasov R.G. Comparative analysis of methods for measuring thermal parameters of integrated microwave power amplifiers on bipolar transistors. Zhurnal radioelektroniki [Journal of Radio Electronics] [online]. 2022. №8. https://doi.org/10.30898/1684-1719.2022.8.11 (In Russian)