"JOURNAL OF RADIO ELECTRONICS" (Zhurnal Radioelektroniki ISSN 1684-1719, N 1, 2019

contents of issue      DOI  10.30898/1684-1719.2019.1.7     full text in Russian (pdf)  

Study of electrochemical characteristics of ion-modified copper for elements of microwave integrated circuits  


I. V. Perinskaya, V. V. Perinsky

Yuri Gagarin State Technical University of Saratov, Polytechnic street, 77, Saratov 410054, Russia


The paper is received on January 17, 2018


Abstract.   Effect of chemical passivation of metals: aluminum, the titan, chrome – correlates with change of impurity composition of the materials ion-implanted by argon and, first of all, with increase in concentration of carbon and also with the volume nanostructural transformations which are shown in amorphicity or dispersion of metals and further formation of pointed crystal and sferolitny inclusions. Application of this method is of interest to protection of copper coverings since their low corrosion resistance is the major factor limiting possible scopes of these coverings and, in particular, their use without protection with films of rare and precious metals. The way of receiving a composite covering on the basis of «thick» (12 microns) the layers of copper applied in IS microwave oven by ion-beam modifying by argon ions is offered are investigated corrosion resistance of microstrip lines on their basis. The hypothesis of use of the ion-modified copper as a gold analog in microwave oven microelectronics devices is stated. Dust removal of a surface of products in the course of ionic radiation as dust particles, impenetrable for ions, lead at chemical etching of coverings to emergence of numerous protrav and a time is important for technological applications of ion-beam passivation. For the solution of this task at the high general level of electronic hygiene, it is necessary to apply implantation of more high-energy ions, repeated ion-beam modifying , pulse vibration in the course of implantation.

Keywords: ion-beam modifying, ionic implantation, nanodimensional pore-free carbon covering, corrosion resistance, «thick» (12 microns) copper layers.


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For citation:

I. V. Perinskaya, V. V. Perinsky. Study of electrochemical characteristics of ion-modified copper for elements of microwave integrated circuits. Zhurnal Radioelektroniki - Journal of Radio Electronics. 2019. No. 1. Available at http://jre.cplire.ru/jre/jan19/7/text.pdf

DOI  10.30898/1684-1719.2019.1.7