The paper is received on January
17, 2018
Abstract.
Effect of chemical passivation of metals: aluminum, the titan, chrome –
correlates with change of impurity composition of the materials ion-implanted
by argon and, first of all, with increase in concentration of carbon and also
with the volume nanostructural transformations which are shown in amorphicity
or dispersion of metals and further formation of pointed crystal and sferolitny
inclusions. Application of this method is of interest to protection of copper
coverings since their low corrosion resistance is the major factor limiting
possible scopes of these coverings and, in particular, their use without
protection with films of rare and precious metals. The way of receiving a composite
covering on the basis of «thick» (12 microns) the layers of copper applied in
IS microwave oven by ion-beam modifying by argon ions is offered are
investigated corrosion resistance of microstrip lines on their basis. The
hypothesis of use of the ion-modified copper as a gold analog in microwave oven
microelectronics devices is stated. Dust removal of a surface of products in
the course of ionic radiation as dust particles, impenetrable for ions, lead at
chemical etching of coverings to emergence of numerous protrav and a time is
important for technological applications of ion-beam passivation. For the
solution of this task at the high general level of electronic hygiene, it is
necessary to apply implantation of more high-energy ions, repeated ion-beam
modifying , pulse vibration in the course of implantation.
Keywords:
ion-beam modifying, ionic implantation, nanodimensional pore-free carbon covering,
corrosion resistance, «thick» (12 microns) copper layers.
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