Journal of Radio Electronics. eISSN 1684-1719. 2023. №11
Contents

Full text in Russian (pdf)

Russian page

 

DOI: https://doi.org/10.30898/1684-1719.2023.11.5

 

THERMOELECTRIC PROCESSES IN MULTI-DIE SYSTEMS

 

V.I. Smirnov 1,2, A.M. Khodakov 1, A.A. Gavrikov 1

 

1 Kotelnikov IRE RAS, Ulyanovsk Branch

432071, Russia, Ulyanovsk, Goncharova st. 48/2

2Ulyanovsk State Technical University,

432027, Russia, Ulyanovsk, Severnyy Venets 32

 

The paper was received August 15, 2023.

 

Abstract. The paper shows results of studies of thermoelectric processes in multi-die systems, a particular case are power modules based on field-effect or bipolar transistors. For a complete description of such processes, it is necessary to know the thermal relations between all transistors of the module, characterized by a matrix of thermal impedances. To measure the elements of the matrix, it is proposed to use the modulation method based on heating each transistor of the module with a variable thermal power and measuring the temperature response to this effect of all other transistors. A thermal model of a multi-die system is also proposed, and based on the solution of the heat equation in the COMSOL Multiphysics environment, the temperature field is calculated on the substrate on which the dies are mounted. The simulation results are in good agreement with the experimental results, which indicates the adequacy of the thermal model.

Key words: thermoelectric processes, multi-die system, power module, thermal impedance matrix, modulation method.

Financing: the work was supported by the Russian Science Foundation under project no. 23-29-00026.

Corresponding author: Gavrikov A.A., a.gavrikoff@gmail.com

References

1. Industry Standard 11 0944-96. Mikroskhemy integral'nyye i pribory poluprovodnikovyye. Metody rascheta, izmereniya i kontrolya teplovogo soprotivleniya [Integrated circuits and semiconductor devices. Methods for calculating, measuring and controlling thermal resistance]. Moscow, GUP NPP Pulsar. 1997. 110 p. (In Russian).

2. Ponomariov S.V., Mischenko S.V., Divin A.G. Teoreticheskie I prakticheskie aspekty teplofizicheskih izmerenii [Theoretical and practical aspects of thermophysical measurements] Tambov, Publishing house of the Tambov state tech. university, 2006. 204 p. (In Russian).

3. Davidson J.N., Stone D.A., Foster M.P. Real-Time Prediction of Power Electronic Device Temperatures Using PRBS-Generated Frequency-Domain Thermal Cross Coupling Characteristics. IEEE Transactions on Power Electronics, 2015, V.30, No.6, P.2950-2961. http://dx.doi.org/10.1109/TPEL.2014.2331285

4. Smirnov V.I., Sergeev V.A., Gavrikov A.A., Shorin A. M. Measurement of cross thermal resistance of power modules. Zhurnal Radioelektroniki - Journal of Radio Electronics. 2019, No. 7. Available at http://jre.cplire.ru/jre/jul19/6/text.pdf, http://dx.doi.org/10.30898/1684-1719.2019.7.6

5. Luo Z., Ahn H., Nokali M. A thermal model for insulated gate bipolar transistor module. IEEE Transactions on Power Electronics, 2004, V.19, No.4, P.902-907. http://dx.doi.org/10.1109/TPEL.2004.830089  

6. Brückner T., Bernet S. Estimation and Measurement of Junction Temperatures in a Three-Level Voltage Source Converter. IEEE Transactions on Power Electronics, 2007, V.22, No.1, P.3-12. http://dx.doi.org/10.1109/TPEL.2006.886651

7. Yun C., Malberti P., Ciappa M., Fichtner W. Thermal component model for electrothermal analysis of IGBT module systems. IEEE Transactions on Advanced Packaging, 2001, V.24, No.3, P.401-406. http://dx.doi.org/10.1109/6040.938309

8. Drofenik U., Kolar J.W. Teaching thermal design of power electronic systems with web-based interactive educational software. 18th Annual IEEE Applied Power Electronics Conference and Exposition (Miami Beach, FL, USA), 2003, V.2, P.1029-1036. http://dx.doi.org/10.1109/APEC.2003.1179343

9. Smirnov V.I., Sergeev V.A., Gavrikov A.A., Shorin A.M. Modulation method for measuring thermal impedance components of semiconductor devices. Microelectronics Reliability. 2018. V.80, P.205-212. https://doi.org/10.1016/j.microrel.2017.11.024

10. Horovitz P., Hill W. The Art of Electronics. Third Edition. Cambridge University Press, 2015.

 

For citation:

Smirnov V.I., Khodakov A.M., Gavrikov A.A. Thermoelectric processes in multi-die systems. // Journal of Radio Electronics. – 2023. – №. 11. https://doi.org/10.30898/1684-1719.2023.11.5 (In Russian)