"JOURNAL OF RADIO ELECTRONICS" (Zhurnal Radioelektroniki ISSN 1684-1719, N 9, 2017

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M. S. Kostin, D. S. Vorunichev

Moscow Technological University (MIREA), Vernadskogo avenue , 78, Moscow 119454, Russia


The paper is received on September 5, 2017


Abstract. The possibility of using the induction method of termovision electrothermy (TVET) for the topology of printed circuit boards for the purpose of nondestructive testing and special design reengineering is investigated. It is shown that TVET-technology is distinguished by its selectivity, inertia, good penetrating ability, and at the same time it is inferior to the technical means of X-ray analysis. Thermal and radiophysical principles of TVET-technology are considered. It is established that by adjusting the geometrical position of the inductor relative to the board, the time of thermal induction holding, as well as the frequency and the input power of the HF-signal, it is possible to achieve a clear and stable thermogram of the topology of conducting layers in the infrared range 8...9,5 μm.

Keywords. TVET, HF-inductor, PCB, defectoscopy, special design reengineering. 


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For citation:

M. S. Kostin, D. S. Vorunichev. Thermovision electrothermy of topology of printed boards in magnetic field of plane HF inductor. Zhurnal Radioelektroniki - Journal of Radio Electronics, 2017, No. 9. Available at http://jre.cplire.ru/jre/sep17/7/text.pdf. (In Russian)