Abstract. The possibility of using the induction
method of termovision electrothermy (TVET) for the topology of printed circuit
boards for the purpose of nondestructive testing and special design
reengineering is investigated. It is shown that TVET-technology is
distinguished by its selectivity, inertia, good penetrating ability, and at the
same time it is inferior to the technical means of X-ray analysis. Thermal and
radiophysical principles of TVET-technology are considered. It is established
that by adjusting the geometrical position of the inductor relative to the
board, the time of thermal induction holding, as well as the frequency and the
input power of the HF-signal, it is possible to achieve a clear and stable
thermogram of the topology of conducting layers in the infrared range 8...9,5
Keywords. TVET, HF-inductor, PCB, defectoscopy, special design reengineering.
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