Zhurnal Radioelektroniki - Journal of Radio Electronics. eISSN 1684-1719. 2020. No. 12
ContentsFull text in Russian (pdf)
DOI https://doi.org/10.30898/1684-1719.2020.12.12
UDC 681.518.3
Research of thermal electric processes in power modules
V. I. Smirnov 1,2, V. A. Sergeev 1,2, A. A. Gavrikov 1, A. A. Kulikov 1
1 Ulyanovsk Branch of the Kotenlikov Institute of Radioengineering and Electronics of the Russian Academy of Sciences, 432071, Ulyanovsk, Goncharova str., 48/2
2 Ulyanovsk State Technical University, Severnyi Venets str., 32, Ulyanovsk 432027, Russia
The paper was received on December 12, 2020
Abstract. The paper describes the results of investigation of thermophysical processes in power modules. Measuring the thermal field caused by dies heating due to flow of heating current shows uniform temperature distribution in the area of dies mount. This indicates that the processes of current localization caused by positive thermal feedback are compensated by the processes of heat transfer between the chips through the DBC board, which has a high thermal conductivity. The modulation method was used to measure the thermal resistance "junction-to-case" of the power module. In this case, the module dies were heated by PWM pulses of the heating current through the antiparallel diodes of the module MOSFETs. The modulation method allows to measure power module thermal resistance, which value is less than 0.1 K/W.
Keywords: power module, MOSFET, thermal resistance, modulation method, temperature field, thermal imaging camera.
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For citation:
Smirnov V.I., Sergeev V.A., Gavrikov A.A., Kulikov A.A. Research of thermal electric processes in power modules. Zhurnal Radioelektroniki - Journal of Radio Electronics. 2020. No.12. https://doi.org/10.30898/1684-1719.2020.12.12 (In Russian)