"JOURNAL OF RADIO ELECTRONICS" (Zhurnal Radioelektroniki ISSN 1684-1719, N 7, 2019

contents of issue      DOI  10.30898/1684-1719.2019.7.6     full text in Russian (pdf)  

UDC 681.518.3

MEASUREMENT OF CROSS THERMAL RESISTANCE OF POWER MODULES

 

V. I. Smirnov 1,2, V. A. Sergeev 1,2, A. A. Gavrikov 1, A. M. Shorin 2

1 Ulyanovsk branch of Kotelnikov Institute of Radioengineering and Electronics of Russian Academy of Sciences, Goncharova 48/2, Ulyanovsk 432071, Russia

2 Ulyanovsk State Technical University, Severny Venets 32, Ulyanovsk, 432027, Russia

 

The paper is received on July 12, 2019

 

Abstract. The paper describes the results of measuring cross coupling characteristics of power MOSFET-modules. Measurements are based on the method using device under test heating by harmonically varying power and measuring the temperature response to such impact. Measurements were performed by Apparatus for Measurement of Thermal Impedance which allows to heat each transistor of power module and to measure the temperature response of other transistors. Measuring thermal impedance matrix components was done by analysis of the thermal impedance on modulation frequency dependence. This method can be used not only for MOSFET- or IGBT-transistors but also for hybrid integrated circuits and PCBs.

Keywords: thermal resistance, thermal impedance matrix, power modules, modulation method.

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For citation:

V. I. Smirnov, V. A. Sergeev, A. A. Gavrikov, A. M. Shorin. Measurement of cross thermal resistance of power modules. Zhurnal Radioelektroniki - Journal of Radio Electronics. 2019. No. 7. Available at http://jre.cplire.ru/jre/jul19/6/text.pdf

DOI  10.30898/1684-1719.2019.7.6